WNB 20g BGA Tin Solder Paste Leaded Sn63/Pb37 Syringe Liquid Flux Melting Point 183℃ PCB Repair Stencil Welding Soldering Tool
WNB 20g BGA Tin Solder Paste Leaded Sn63/Pb37 Syringe Liquid Flux Melting Point 183℃ PCB Repair Stencil Welding Soldering Tool
WNB 20g BGA Tin Solder Paste Leaded Sn63/Pb37 Syringe Liquid Flux Melting Point 183℃ PCB Repair Stencil Welding Soldering Tool
WNB 20g BGA Tin Solder Paste Leaded Sn63/Pb37 Syringe Liquid Flux Melting Point 183℃ PCB Repair Stencil Welding Soldering Tool
WNB 20g BGA Tin Solder Paste Leaded Sn63/Pb37 Syringe Liquid Flux Melting Point 183℃ PCB Repair Stencil Welding Soldering Tool
WNB 20g BGA Tin Solder Paste Leaded Sn63/Pb37 Syringe Liquid Flux Melting Point 183℃ PCB Repair Stencil Welding Soldering Tool
WNB 20g BGA Tin Solder Paste Leaded Sn63/Pb37 Syringe Liquid Flux Melting Point 183℃ PCB Repair Stencil Welding Soldering Tool
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WNB 20g BGA Tin Solder Paste Leaded Sn63/Pb37 Syringe Liquid Flux Melting Point 183℃ PCB Repair Stencil Welding Soldering Tool

Vendor
saleaxis
Regular price
$14.99
Sale price
$14.99
Regular price
$19.94
Sold out
Unit price
per 

SPECIFICATIONS

Type: Soldering Tin Paste

Stored Temperature: 0-10℃

Sn Content: 63%

Pb Content: 37%

Particle Size: 25-48μm

Package: Anti-static Bag

Origin: CN(Origin)

Net Weight: About 20.0g / pcs

Model Number: N025

Melting Point: 183℃

Gross Weight: About 30.0g / set

Certification: CE

Brand Name: WNB

Application: For Industrial Use Only



Model
 WNB 183℃ Soldering Flux Solder Tin Paste
Melting Point
 183℃
Tin (Sn) Content
 63.0%
Lead (Pb) Content
 37.0%
Feature
 Tack lasting, easy to dry, sticky time for more than 48 hours.
Environmental Performance
 A colorless transparent, does not affect the test, fine-clean and cleaning performance.
Stored
 Products wetting, anti-dry and strong, long shelf life at room temperature.
Application
 PCB board repair essential materials
Net Weight
 About 20.0g / pcs
Gross Weight
 About 35.0g / set


What is the solder tin paste?

  • Solder tin paste is a new type of solder material that comes with SMT.
  • Solder paste is a complex system that is made of a paste of solder powder, flux, and other additives.
  • At the normal temperature, the solder tin paste has a certain viscosity, and the electronic component can be initially adhered to a predetermined position.
  • At the soldering temperature, the soldered component and the printed circuit pad are soldered together(Permanent connection.) with the evaporation of the solvent and some additives.

Instructions:

  • Before the opening, the temperature of the solder paste should be raised to the ambient temperature (25℃), and the temperature return time should be about 3-4 hours. It is forbidden to use other heaters to raise the temperature instantaneously.
  • After the solder paste is opened, it is recommended to use it within 24 hours at room temperature.
  • Placed in the air for a long time, the solder paste will become a tin block due to moisture absorption.
  • The indoor temperature should be controlled at 22-28 ℃, and the humidity RH30-60% is the best working environment.
  • To wipe the wrong substrate, it is recommended to use industrial alcohol or industrial cleaner.

Preservation method:

  • The solder paste should be kept at 1-10℃.
  • The solder paste should be used for 6 months.
  • The solder paste should not be placed in the sun.

Precautions:

  • Use only with adequate Ventilation.
  • The solder paste contains organic solvent. Avoid repeated contact with skin. If the solder paste gets on your skin, wipe it off with alcohol and rinse thoroughly with water.
  • In order to be cautious, in the operation, the smoke released by the solvent during operation should be avoided as much as possible, and the skin and mucous membrane tissues should not be contacted for too long. Avoid repeated breathing of vapor.
  • Avoid contacting with eyes.
  • Keep away from children.

Warm tip:

  • If you like this item, please add it to your wish list, if you like my store, please add it to you store list.
  • We provide big order big discount, if you have any question, please feel free to contact us, thank you very much!

Attention Please:

  • Light shooting and different displays may cause the color of the item in the picture a little different from the real thing.
  • The measurement allowed error is ±2.0 cm.
  • The two products in the first picture are mainly to show the capacity of the product. The package only includes one solder tin paste, one needle mouth and one putter.

WNB 20.0g 183℃ Syringe Solder Tin Paste

SMART DESIGN

The residue is colorless and transparent, does not affect the detection, disposable and excellent cleaning performance. Use of efficient energy thixotropic agents, printing and preheating collapse, special solder ensure a good printing and fine pattern.

MORE POWERFUL

New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.

PROFESSIONAL R&D TEAM

More advanced insulation technology, tack lasting, easy to change to dry, the viscous time up to 48 hours or more.

PCB/BGA DEDICATED

High-end quality, a unique formula, perfect performance, easy to weld, solder joint is bright and full, no weld, false welding phenomenon.

WIDELY APPLICABLE

Adapted to the mobile phone repair industry, computer digital service industries and high-precision circuit board soldering SMD/BGA soldering processes.

REVOLUTIONARY DURABILITY

Wetting, anti-dry, relatively long shelf life at room temperature (keep away from light).

CONCISE & DELICATE

Unique high-quality solder paste, fine and flexible packaging (10cc/support), delicate appearance.

Uncompromising performance in an ultra light ultra thin body, heavyweight performance, without the weight.

  • 1* WNB 183℃ Solder Tin Paste
  • 1* Piston
  • 1* Needle

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